| 标题 |
Enhancement of Electromigration Reliability of Electroless-Plated Nanoscaled Copper Interconnects by Complete Encapsulation of a 1 nm-Thin Self-Assembled Monolayer |
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| DOI | |
| 其它 |
期刊:Journal of The Electrochemical Society 作者:Giin-Shan Chen; Ching-En Lee; Yi-Lung Cheng; Jau-Shiung Fang; Chien-Nan Hsiao; et al 出版日期:2022-08-01 |
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(2025-6-4)