| 标题 |
The encaging of cobalt interconnect lines with an ordered amino-based self-assembled monolayer for electromigration mitigation using an all-wet electroless process |
| 网址 | |
| DOI | |
| 其它 |
期刊:Thin Solid Films 作者:Jau-Shiung Fang; Wei Lee; Yi-Lung Cheng; Chih-I Lin; Giin-Shan Chen 出版日期:2025-04-01 |
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(2025-6-4)