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143 积分 2020-06-10 加入
Application of low-temperature soldering in TE material/electrode interfaces of thermoelectric devices: a review
7天前
已完结
Characterization and optimization of bonding and interconnect technology for 3D stacking thin dies
10天前
已完结
Plasma Jet Printing for Printed Electronics
12天前
已完结
Microadditive Manufacturing Technologies of 3D Microelectromechanical Systems
15天前
已完结
Enabling Technologies for Applying Fluids in Semiconductor Packaging
16天前
已关闭
Jetting: Discrete Dispensing of High Viscosity Fluid
16天前
已关闭
Flow Characterization of Capillary Underfill in Multi-Chip Heterogenous Integration Using Computational Fluid Dynamics
16天前
已完结
Embedded electrohydrodynamic printing of magnetically responsive microspheres
1个月前
已完结
Recent trends in structures and applications of valveless piezoelectric pump—a review
1个月前
已完结
Flow direction of piezoelectric pump with nozzle/diffuser-elements
4个月前
已关闭
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