| 标题 |
Characterization and optimization of bonding and interconnect technology for 3D stacking thin dies |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena 作者:Pavani Vamsi Krishna Nittala; Karthika Haridas; Shivam Nigam; Saba Tasneem; Prosenjit Sen 出版日期:2021-08-25 |
| 求助人 | |
| 下载 | 暂无链接,等待应助者上传 |
PDF的下载单位、IP信息已删除
(2025-6-4)