Lv3
290 积分 2024-07-28 加入
Fundamentals and Failures in Die Preparation for 3D Packaging
3个月前
已关闭
Root cause analysis to predict the die cracks in the multichip package
3个月前
已完结
Evaluation of die edge cracking in flip-chip PBGA packages
3个月前
已完结
H 3 : Hybrid Architecture Using High Bandwidth Memory and High Bandwidth Flash for Cost-Efficient LLM Inference
6个月前
已完结
Interfacial reactions, microstructure and mechanical properties of Pb-free solder joints in PBGA laminates
7个月前
已完结
Effects of Au and Pd in Pad Surface Finish on Electro-Migration of Flip Chip Interconnection Between Cu-Pillar and Sn-Bi Solder Alloy System
7个月前
已完结
IMC formation between electroless Ni/Pd/Au surface finish and SnAgCu solder
7个月前
已完结
Evolution mechanism of interconnect interface and shear properties of 64.8Sn35.2Pb microbump during flip chip bonding
7个月前
已完结
Laser ablation and stealth dicing of full-thickness silicon wafer
1年前
已完结
AI-Based Mobile Edge Computing for IoT: Applications, Challenges, and Future Scope
1年前
已完结
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