Lv2
140 积分 2025-10-21 加入
Copper-doped polypyrrole composite film formed by in-situ polymerization as a conductive seed layer for printed circuit boards and blind hole electroplating filling
2个月前
已完结
Acoustic-streaming driven liquid filling patterns inside through-glass vias
3个月前
已关闭
Electronics on any surface
3个月前
已完结
Laser-induced microscale copper trace deposition on glass and PET substrates
3个月前
已完结
Back reflection analysis for sensing laser drilled through-glass vias
4个月前
已关闭
Evaluation of thermal characteristics of laser induced heating of microfilm in relation to printed circuit board manufacturing
5个月前
已完结
Low damage regulation process and mechanism of laser selective copper removal on FR-4 PCB substrate
7个月前
已完结
Exploring the efficacy of water jet guided laser for cutting of tungsten carbide backed polycrystalline diamond
7个月前
已完结
Wear behaviors of PCD and diamond-coated tools during low-frequency vibration-assisted drilling CFRP/Ti stacks
8个月前
已完结
Machinability of the uncoated and Ta–C-coated single-flute microdrills in dry machining of PCBs
8个月前
已完结
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