| 标题 |
Copper-doped polypyrrole composite film formed by in-situ polymerization as a conductive seed layer for printed circuit boards and blind hole electroplating filling |
| 网址 | |
| DOI | |
| 其它 |
期刊:Applied Surface Science 作者:Xiao Zhang; Xixun Shen; Yuhang Li; Wang Tang; Ruiqi Wang; et al 出版日期:2026-03-23 |
| 求助人 | |
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(2025-6-4)