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114 积分 2026-08-21 加入
A Review on Gate Oxide Failure Mechanisms of Silicon Carbide Semiconductor Devices
20天前
已完结
Time-Dependent Breakdown Mechanisms and Reliability Improvement in Edge Terminated AlGaN/GaN Schottky Diodes Under HTRB Tests
23天前
已完结
HTRB failure mechanism of 1200 V SiC MOSFET induced by abnormal electric field distribution in FLR termination
23天前
已完结
Investigation on the threshold voltage instability mechanism of p-GaN gate AlGaN/GaN HEMTs under high-temperature reverse bias stress
23天前
已完结
Reliability analysis for TO-247 multilayered power module packaging under mechanical oscillation based on finite element method
1个月前
已完结
Combination of thermal cycling and vibration loading effects on the fatigue life of solder joints in a power module
1个月前
已完结
Reliability testing of electronic packages in harsh environments
1个月前
已完结
Large-area sintering of nano-copper for power module packaging and thermal-shock reliability
1个月前
已完结
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