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40 积分 2023-05-18 加入
Electric-current-assisted sintering of nanosilver paste for copper bonding
3个月前
已完结
Development of an Antioxidation Copper Paste with Self-Reducing Copper Formate and Molecular Dynamics Analysis of Sintering Mechanisms
3个月前
已完结
Air-sinterable copper pastes for next-generation electronics: a review
3个月前
已完结
Novel copper aggregates with "Gear Chimerism" structures: High electrical conductivity, oxidation resistance, and long-term stability
3个月前
已完结
Stabilization of the thermal decomposition process of self-reducible copper ion ink for direct printed conductive patterns
4个月前
已完结
Preparation of copper submicronparticles and application to conductive paste
6个月前
已完结
Simple synthesis of copper sulfide film using self-reducible copper formate-amine-sulfur complex paste at less than 200 °C
6个月前
已完结
Extraordinarily enhanced sintering performance of pressureless sinterable Cu nanoparticle paste for achieving robust die-attach bonding by using reducing hybrid solvent
8个月前
已完结
Self-reducible copper inks composed of copper–amino complexes and preset submicron copper seeds for thick conductive patterns on a flexible substrate
8个月前
已完结
Pressureless sinter-joining of copper pastes below 200 °C via multi-solvent collaborative engineering
9个月前
已关闭
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