Lv1
40 积分 2023-05-18 加入
Preparation of copper submicronparticles and application to conductive paste
1个月前
已完结
Simple synthesis of copper sulfide film using self-reducible copper formate-amine-sulfur complex paste at less than 200 °C
1个月前
已完结
Extraordinarily enhanced sintering performance of pressureless sinterable Cu nanoparticle paste for achieving robust die-attach bonding by using reducing hybrid solvent
3个月前
已完结
Self-reducible copper inks composed of copper–amino complexes and preset submicron copper seeds for thick conductive patterns on a flexible substrate
3个月前
已完结
Pressureless sinter-joining of copper pastes below 200 °C via multi-solvent collaborative engineering
4个月前
已关闭
In-air sintering of copper nanoparticle paste with pressure-assistance for die attachment in high power electronics
5个月前
已完结
Anti-oxidation copper powder with constructed calcium silicate hydrate nano-barrier layer for printable electrode paste
7个月前
已完结
Preparation and conductive mechanism of copper nanoparticles ink
7个月前
已完结
A low temperature and air-sinterable copper–diamine complex-based metal organic decomposition ink for printed electronics
7个月前
已完结
Fabrication of Nano Copper Highly Conductive and Flexible Printed Electronics by Direct Ink Writing
7个月前
已完结
皖公网安备34019202002308
