Lv3
248 积分 2024-01-10 加入
Reliability analysis of TSV silicon perforated structures under thermal cyclic loading
25天前
已完结
A novel coaxial open annular TSV pin-fin embedded in microchannels to comprehensively improve the thermal stability, signal integrity, and heat transfer of 3D integrated circuits
27天前
已关闭
Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging
1个月前
已完结
Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging
2个月前
已完结
The microstructure and strength of a tantalum alloy: Influence of temperature
2个月前
已完结
Unravelling precipitation behavior and mechanical properties of Al–Zn–Mg–Cu alloy
2个月前
已完结
Study on the Effect of Film Process on Interface and Interconnection Reliability in the TSV Structure
4个月前
已关闭
In‐Chip Mechanical Reliability Characterization and Modeling of CMOS‐Based Memristor for 3D Integration
5个月前
已完结
Reduction of thermal disturbances in 3D 1S1R RRAM crossbar arrays for neuromorphic computing
6个月前
已完结
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