| 标题 |
A novel coaxial open annular TSV pin-fin embedded in microchannels to comprehensively improve the thermal stability, signal integrity, and heat transfer of 3D integrated circuits |
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| DOI | |
| 其它 |
期刊:International Communications in Heat and Mass Transfer 作者:Ying Yin; Zhimin Wang; Siyuan Ma; Yan Li; Liang Gong 出版日期:2026-01-27 |
| 求助人 | |
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(2025-6-4)