Lv4
770 积分 2023-10-25 加入
Development of Low Cost Glass-Based Deep Trench Capacitor for 3D Packaging
2个月前
已完结
Research on deep trench capacitor structure design and its effect on capacitance density and breakdown voltage
3个月前
已完结
Cu–Cu hybrid bonding technology: from physical mechanisms to system integration for 3D ICs
3个月前
已完结
Controlled interfacial debonding based on laser induced deformation-impact coupling effect for advanced packaging
4个月前
已完结
Molecular dynamics study of grain size effects on interfacial voids in Cu Cu diffusion bonding
4个月前
已完结
Corrigendum to “Molecular dynamics study of grain size effects on interfacial voids in Cu–Cu diffusion bonding” [Appl. Surface Sci. 720 (2026) 165145]
4个月前
已关闭
Grain morphology effect on interfacial void closure in Cu–Cu bonding for advanced semiconductor packaging
4个月前
已完结
Influence of deposition conditions on ALD based Ru passivation for Cu-Cu hybrid bonding
4个月前
已完结
A Review of Glass Substrate Technologies
6个月前
已完结
Investigation of Wet Pretreatment to Improve Cu-Cu Bonding for Hybrid Bonding Applications
6个月前
已完结
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