Lv71
4200 积分 2022-03-04 加入
Advanced Dielectric Materials (Polyimides and Polybenzoxazoles) for Fan‐Out Wafer‐Level Packaging (FO‐WLP)
1个月前
已完结
Reduced plasma-induced chaging damage in SOI MOSFETs
5个月前
已完结
Intrinsic and extrinsic reliability of a serial connection of capacitors
7个月前
已完结
Characterization of alterations on power MOSFET devices under extreme electro-thermal fatigue
7个月前
已完结
Reliability characterization of Chip-on-Wafer-on-Substrate (CoWoS) 3D IC integration technology
1年前
已完结
Qualification of bumping processes: Experimental and numerical investigations on mechanical stress and failure modes induced by shear test
1年前
已完结
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