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86 积分 2024-08-02 加入
Effect of Process Parameters on Material Removal Rate in Chemical Mechanical Polishing of 6H-SiC(0001)
2天前
已完结
Piezocatalysis for Chemical–Mechanical Polishing of SiC: Dual Roles of t‐BaTiO3 as a Piezocatalyst and an Abrasive
5个月前
已完结
Triboelectric-induced abnormal tribovoltaic effect at the metal-GaN interface
5个月前
已完结
Mechanisms underlying the nucleation processes of mesoporous ceria nanoparticles
5个月前
已完结
A Novel Grinding Technique for 4H-SiC Single-Crystal Wafers Using Tribo-Catalytic Abrasives
7个月前
已完结
Hand-powered interfacial electric-field-enhanced water disinfection system
1年前
已完结
Pulsed Electrocatalysis: A Potential Strategy for Regulating the Heterogeneous Electrocatalytic Reduction Reaction
1年前
已完结
Pulsed Electrocatalysis: A Potential Strategy for Regulating the Heterogeneous Electrocatalytic Reduction Reaction
1年前
已完结
Functional Conductive Hydrogels for Bioelectronics
1年前
已完结
Boosting Electronic Charge Transport in Conductive Hydrogels via Rapid Ion‐Electron Transduction
1年前
已完结
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