Lv5
864 积分 2025-07-29 加入
Correlation of Polishing Pad Property and Pad Debris on Scratch Formation during CMP
1个月前
已关闭
A Mechanics-Based Predictive Model for Scratching Defects and its Application for Pad Selection in Chemical Mechanical Polishing
1个月前
已完结
Preparation of Open-Cell Rigid Polyimide Foam via Nonaqueous High Internal Phase Emulsion-Templating Technique
1个月前
已完结
Systematic Design of Chemical Oscillators. Part 44. Kinetics and Mechanism of H2O2 Decomposition Catalyzed by Cu2+ in Alkaline Solution
1个月前
已关闭
Research progress of ceria abrasives in STI CMP: optimization and application
1个月前
已完结
Study on fine particle behavior in slurry flow between wafer and polishing pad as a material removal process in CMP
1个月前
已关闭
Unsteady Multiphase CFD Analysis of Slurry Flow in a 300 mm CMP System: Effect of Rotation Speed and Slurry Flow Rate
1个月前
已完结
ILD-CMP Wafer Edge Thickness Profile Stability Improvement via Acid Silicon Oxide Slurry Formulation Design
1个月前
已完结
The Mechanism of Low pH Silica Based Oxide Slurries
1个月前
已关闭
Thermal Insulated Cyclic Olefin Copolymer Foam via Supercritical CO2 Foaming from Nano-Interphase in Self-reinforced Blends
1个月前
已完结
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