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50 积分 2026-01-29 加入
Electrically Conductive Adhesives in Microelectronics Packaging
1个月前
已完结
The effects of increasing filler loading on the contact resistivity of interconnects based on silver–epoxied conductive adhesives and silver metallization pastes
2个月前
已完结
Effect of Sn Orientation on Electromigration Failure in CuSn Solders
2个月前
已完结
Cyanate Ester—Epoxy Blends for Structural and Functional Composites
3个月前
已完结
Influence of fillers on epoxy resins properties: a review
3个月前
已完结
Controlled synthesis and evaluation of cyanate ester/epoxy copolymer system for high temperature molding compounds
3个月前
已完结
Investigation on mechanical properties and thermal expansibility of epoxy resin copolymerization modified cyanate ester under medium‐low temperature curing process
3个月前
已完结
Tailoring the cage and functionality of POSS for scalable low-dielectric and tough cyanate ester hybrid resin
3个月前
已完结