Lv674
2160 积分 2025-03-10 加入
Plasma-deposited tungsten-doped amorphous carbon films for advanced dry etching hardmasks
3天前
已完结
Advances in Doping Modification and Processing of Diamond-like Carbon Coatings: A Review
3天前
已完结
Tungsten-Doped Amorphous Carbon Deposited by Plasma Enhanced Chemical Vapor Deposition for Dry Etching Hardmask Applications
3天前
求助中
(Invited) Cobalt Interconnects at 36nm Beol Pitch and Beyond: Material Challenges & Circuit-Level Performance Impact
6天前
已关闭
(Invited) Metallizations for Advanced Interconnects and Challenges for Future Nodes
6天前
已关闭
Enhancing Copper and Molybdenum Chemical Mechanical Planarization Performance with Megasonic Activated Slurry Formulations
19天前
已关闭
Study of Tungsten-Doped Carbon Hard Mask Etch Process Using NF3/O2 Based Chemistry
25天前
已完结
Interconnects Materials for Integrated Circuit Technology Below 5 Nm Node
25天前
已完结
Interconnects Materials for Integrated Circuit Technology Below 5 Nm Node
28天前
已关闭
Nanoscale Wet Etching of Molybdenum Interconnects with Organic Solutions
1个月前
已完结
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