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72 积分 2026-09-03 加入
Pixel‐Engineered Deep Ultraviolet Micro‐LED Arrays for High‐Speed Optical Interconnects
12天前
已完结
Photonic chip packaging for extreme environments
13天前
已完结
A metal micro-dot array-based alignment-free flip-chip bonding technique for Micro-LED display fabrication
13天前
已完结
In situ dry repair and passivation unlocks size-independent performance in Ⅲ-nitride micro-LEDs
17天前
已完结
Stitching-loss-tolerant silicon nitride waveguides on glass for panel-level optical interconnects
28天前
已完结
Co-packaged optics for high-performance computing and artificial intelligence
1个月前
已完结
High Temperature and Large Bandwidth Blue InGaN/GaN Micro-LEDs
1个月前
已完结
MicroLED Array-based Optical Links Using Imaging Fiber for Chip-to-chip Communications
1个月前
已完结
Comparison of Beyond 1 GHz C-Plane Freestanding and Sapphire-Substrate GaN-Based micro-LEDs for High-Speed Visible Light Communication
1个月前
已完结
Research Progress and Challenges of GaN‐Based Micro‐LEDs in Short‐Reach Optical Interconnects
1个月前
已完结
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