Lv41
710 积分 2026-01-23 加入
Growth mechanism of intermetallic compound in SnAg/Cu interface of micro-bumps under extremely low-temperature by phase field method
5小时前
已完结
Incomplete dissolved behavior and mechanical analysis of SnAgCu-SnBi composite solder structures for high-reliable package-on-package techniques
5小时前
已完结
Investigation on electromigration failure behavior of SAC305/SnPb micro-hybrid solder joints for package-on-package techniques: Experiment and simulation
5小时前
已完结
Microwave hybrid joining using SAC305-xNi@Sn solder paste to achieve superior performance and high-efficiency heating and unveiling cross-scale mechanisms
5小时前
求助中
Investigation on Electromagnetic and Heat Transfer Coupling of Heating Susceptor for Selective Microwave Hybrid Soldering: 3d Multi-Physics Simulation and Experiment
5小时前
求助中
Microwave hybrid joining of SAC305-Ni@Sn composite solder: Heating mechanism, mechanical reliability, and first-principles calculation
5小时前
已完结
High-performance soldering achieved through an energy-efficient magnetic field-assisted microwave hybrid joining: A multiscale study via molecular dynamics and first-principles calculations
5小时前
已完结
Air-reactive cladding assisted brazing of Y2O3-MgO nanocomposite ceramic to TC4 alloy: Interfacial reaction mechanism and mechanical property
5小时前
已完结
Recent achievements and performance of nanomaterials in microwave absorption and electromagnetic shielding
5小时前
已完结
High-Strength Air-Brazed Al2o3 Ceramics Joint with Reinforced Interface Via In-Situ Formation of Cu2al6b4o17 Whiskers
5小时前
已完结
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