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High Temperature Characteristics of Piezoresistive Silicon Carbide Pressure Sensors Implemented by Leadless Packaging
10小时前
待确认
A review of the thermal conductivity of silver-epoxy nanocomposites as encapsulation material for packaging applications
10小时前
已完结
A Novel Packaging Structure and Process for High Temperature Silicon Piezoresistive Pressure Sensor
16小时前
已完结
A high temperature sensor with highly reliable sealing structure
28天前
已完结
High Temperature Characteristics of Piezoresistive Silicon Carbide Pressure Sensors Implemented by Leadless Packaging
5个月前
已完结
Investigation on Piezoresistive Effect of n-Type 4H-SiC Based on All-SiC Pressure Sensors
6个月前
已完结
Modellbildung für das Ultraschall-Drahtbonden
7个月前
已完结
Analysis of Wire Bonding Pull-off/Shear Force for Various Wire Materials and Contact Pads
8个月前
已关闭
Investigation of MEMS Single Turn Meander-Shaped Silicon Carbide Piezoresistive Pressure Sensor on a Clamped Circular Diaphragm for High Pressure Harsh Environment Applications
8个月前
已完结
Study on Silicon Carbide High-Temperature Pressure Sensor Based on Mems Technology
9个月前
已关闭
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