Lv2
120 积分 2023-09-07 加入
Advanced processing control for wafer-to-wafer hybrid bonding
9个月前
已完结
Recessive self-aligned double patterning with gap-fill technology
11个月前
已完结
Module-level material engineering for continued DRAM scaling
11个月前
已关闭
Low sheet resistance buried metal bit line realized by high temperature metal CVD process in vertical channel transistor array
11个月前
已关闭
High Quality Vertical Silicon Channel by Laser-Induced Epitaxial Growth for Nanoscale Memory Integration
1年前
已关闭
Therapeutic effects of masitinib on abnormal mechanoreception in a mouse model of tourniquet-induced extremity ischemia-reperfusion
11个月前
已采纳
Investigation of Si/Si bond interface fabricated using room temperature direct bonding
11个月前
已采纳
Photophysical properties of the fluorescent probe NHI for the detection of phosgene based on ESIPT process: A DFT/TD-DFT study
11个月前
已采纳
Direct evidence of bound water as proton acceptor in poly(vinyl alcohol) films via fluorescent probe and TDDFT calculations
11个月前
已采纳
皖公网安备34019202002308
