Lv11
90 积分 2023-09-07 加入
Advanced processing control for wafer-to-wafer hybrid bonding
15分钟前
已完结
Recessive self-aligned double patterning with gap-fill technology
1个月前
已完结
Module-level material engineering for continued DRAM scaling
1个月前
已关闭
Low sheet resistance buried metal bit line realized by high temperature metal CVD process in vertical channel transistor array
2个月前
已关闭
High Quality Vertical Silicon Channel by Laser-Induced Epitaxial Growth for Nanoscale Memory Integration
3个月前
已关闭
Understanding the stress effect of TiN top electrode on ferroelectricity in Hf0.5Zr0.5O2 thin films
1年前
已完结
Reliability of TCAD study for HfO2-doped Negative capacitance FinFET with different Material-Specific dopants
2年前
已完结
Evolution of phases and ferroelectric properties of thin Hf0.5Zr0.5O2 films according to the thickness and annealing temperature
2年前
已完结
Therapeutic effects of masitinib on abnormal mechanoreception in a mouse model of tourniquet-induced extremity ischemia-reperfusion
1个月前
已采纳
Investigation of Si/Si bond interface fabricated using room temperature direct bonding
1个月前
已采纳
Photophysical properties of the fluorescent probe NHI for the detection of phosgene based on ESIPT process: A DFT/TD-DFT study
1个月前
已采纳
Direct evidence of bound water as proton acceptor in poly(vinyl alcohol) films via fluorescent probe and TDDFT calculations
1个月前
已采纳
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