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54 积分 2023-05-17 加入
Surface Copper Voids in BEOL Copper Metal Layers
4个月前
已完结
Void Defect Improvement with Barrier Metal-Cu Seed and Electroplating Recipes Optimization
4个月前
已完结
The via resistance analysis at ALD-to-PVD TaN transition layer
4个月前
已完结
Galvanic Corrosion Effect of Co Liner on ALD TaN Barrier
5个月前
已完结
A Multiscale Study on Interfacial Properties of Ru-doped TaN in Advanced Interconnects
5个月前
已完结
Next generation nanopatterning using small molecule inhibitors for area-selective atomic layer deposition
5个月前
已完结
Selective Barrier for Cu Interconnect Extension in 3nm Node and Beyond
5个月前
已完结
Extreamly Advanced Cu Interconnect with Selective ALD Barrier for High Performance Logic Device
5个月前
已完结
Plasma enhanced atomic layer deposition of Co glue layer using CCTBA precursor
11个月前
已关闭
Enhancing Cu interconnect reflow in back-end-of-line metal wiring with ultrathin Co liners
1年前
已完结
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