Lv11
54 积分 2023-05-17 加入
Surface Copper Voids in BEOL Copper Metal Layers
5天前
已完结
Void Defect Improvement with Barrier Metal-Cu Seed and Electroplating Recipes Optimization
5天前
已完结
The via resistance analysis at ALD-to-PVD TaN transition layer
12天前
已完结
Galvanic Corrosion Effect of Co Liner on ALD TaN Barrier
19天前
已完结
A Multiscale Study on Interfacial Properties of Ru-doped TaN in Advanced Interconnects
20天前
已完结
Next generation nanopatterning using small molecule inhibitors for area-selective atomic layer deposition
27天前
已完结
Selective Barrier for Cu Interconnect Extension in 3nm Node and Beyond
1个月前
已完结
Extreamly Advanced Cu Interconnect with Selective ALD Barrier for High Performance Logic Device
1个月前
已完结
Plasma enhanced atomic layer deposition of Co glue layer using CCTBA precursor
7个月前
已关闭
Enhancing Cu interconnect reflow in back-end-of-line metal wiring with ultrathin Co liners
8个月前
已完结
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