Lv31
306 积分 2023-03-11 加入
Low-temperature sintering of Ag nanoparticles for high-performance thermoelectric module design
2小时前
待确认
An electroplated copper–silver alloy as antibacterial coating on stainless steel
2个月前
已完结
Size and Solid Solubility in Electrodeposited Ag-Ni Nanoparticles
5个月前
已完结
Electrodeposition of Metastable Au–Ni Alloys
5个月前
已关闭
Low-temperature sintering of Ag nanoparticles for high-performance thermoelectric module design
6个月前
已完结
Morphology Dependence of Ag-Ni Solid Solubility
7个月前
已完结
Monolithic nanoporous copper by dealloying Mn–Cu
7个月前
已完结
Measurements of electron—phonon coupling factor and interfacial thermal resistance of metallic nano-films using a transient thermoreflectance technique
1年前
已完结
3-layer Fine Pitch Cu-Cu Hybrid Bonding Demonstrator With High Density TSV For Advanced CMOS Image Sensor Applications
1年前
已完结
Low Resistance and High Isolation HD TSV for 3-Layer CMOS Image Sensors
1年前
已完结
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