Lv3
316 积分 2023-03-11 加入
Electrodeposition of Metastable Au–Ni Alloys
1天前
求助中
Low-temperature sintering of Ag nanoparticles for high-performance thermoelectric module design
1个月前
已完结
Morphology Dependence of Ag-Ni Solid Solubility
1个月前
已完结
Monolithic nanoporous copper by dealloying Mn–Cu
2个月前
已完结
Measurements of electron—phonon coupling factor and interfacial thermal resistance of metallic nano-films using a transient thermoreflectance technique
8个月前
已完结
3-layer Fine Pitch Cu-Cu Hybrid Bonding Demonstrator With High Density TSV For Advanced CMOS Image Sensor Applications
8个月前
已完结
Low Resistance and High Isolation HD TSV for 3-Layer CMOS Image Sensors
8个月前
已完结
Copper Microstructure Optimization for Fine Pitch Low Temperature Cu/SiO2 Hybrid Bonding
8个月前
已完结
Wafer-On-Wafer-On-Wafer (WoWoW) Integration Having Large-scale High Reliability Fine 1 μm Pitch Face-To-Back (F2B) Cu-Cu Connections and Fine 6 μm Pitch TSVs
8个月前
已完结
Novel three-layer stacking process with face-to-back CoW 6 μm-pitch hybrid bonding
8个月前
已完结
皖公网安备34019202002308
