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80 积分 2026-03-03 加入
Material, Process and System Level Analysis for Parasitic Reduction of Next Generation Logic Technology in Conjunction with Backside Power Delivery
1个月前
已完结
A Physics-based Thermal Model of Nanosheet MOSFETs for Device-Circuit Co-design
2个月前
已完结
Thermal resistance modeling of back-end interconnect and intrinsic FinFETs, and transient simulation of inverters with capacitive loading effects
2个月前
已完结
Thermal resistance modeling of back-end interconnect and intrinsic FinFETs, and transient simulation of inverters with capacitive loading effects
2个月前
已完结
Comparison of self-heating effect (SHE) in short-channel bulk and ultra-thin BOX SOI MOSFETs: Impacts of doped well, ambient temperature, and SOI/BOX thicknesses on SHE
2个月前
已完结
Self-Heating Mitigation of TreeFETs by Interbridges
2个月前
已完结
Analysis of Thermal Resistance Considering Self-Heating Effects and Ambient Temperature Coupling for Double-SOI MOSFETs
2个月前
已完结
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