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10 积分 2026-07-22 加入
Large-area sintering of nano-copper for power module packaging and thermal-shock reliability
1个月前
已完结
A New Structure of Ceramic Substrate to Reduce the Critical Electric Field in High Voltage Power Modules
1个月前
已完结
Design of a Lightweight Low Inductance Power Module with Ceramic Baseplates
1个月前
已完结
A 900A High Power Density and Low Inductive Full SiC Power Module for High Temperature Applications based on 900V SiC MOSFETs
1个月前
已完结
Design and fabrication of a ceramic substrate-embedded SiC power module
1个月前
已完结
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