Lv11
90 积分 2025-04-02 加入
Physics of the Coefficient of Friction in CMP
3小时前
已关闭
Two-Step Chemical Mechanical Polishing of 4H-SiC (0001) Wafer
13天前
已完结
A Facile One-Pot Synthesis of δ-MnO2 Catalyst for Efficient Chemical Mechanical Polishing of SiC Wafer
28天前
已完结
Fujimi’s New SiC CMP Slurry Development
28天前
已关闭
Chemical Mechanical Polishing of TiN Film with Potassium Permanganate and L-Aspartic Acid in Alkaline Slurry
1个月前
已完结
Accelerated C-face polishing of silicon carbide by alkaline polishing slurries with Fe3O4 catalysts
1个月前
已完结
Defect-Engineered MnO2 as Catalyst for the Chemical Mechanical Polishing of Silicon Carbide Wafer
1个月前
已完结
Comparative study on MnO2, Mn2O3, and Mn3O4: Enhancing chemical-mechanical polishing properties of 4H-SiC silicon wafers
1个月前
已完结
Double-Oxidant-Induced Slurry Reaction Mechanism and Performance on Chemical Mechanical Polishing of 4H-SiC (0001) Wafer
1个月前
已完结
Chemical Mechanical Polishing for Monocrystal SiC Assisted by the Heterogeneous Sono-Fenton Oxidation
1个月前
已完结
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