Lv4
710 积分 2025-05-04 加入
3-STAR: A Super-steep switching, Stackable, and Strongly Reliable Transistor Array RAM for Sub-10nm DRAM and beyond
1天前
待确认
3D X-DRAM: A Novel 3D NAND-like DRAM Cell and TCAD Simulations
1天前
已完结
Morphotropic Phase Boundary of Hf1–xZrxO2 Thin Films for Dynamic Random Access Memories
30天前
已完结
Integration of 0.75 V VDD Oxide-Semiconductor 1T1C Memory with Advanced Logic for an Ultra-Low-Power Low-Latency Cache Solution
5个月前
已完结
High-Density Wafer Level Connectivity Using Frontside Hybrid Bonding at 250nm Pitch and Backside Through-Dielectric Vias at 120nm Pitch After Extreme Wafer Thinning
5个月前
已完结
The Incredible Shrinking Transistor - Shattering Perceived Barriers and Forging Ahead
5个月前
已完结
Intel 18A Platform Technology Featuring RibbonFET (GAA) and PowerVia for Advanced High-Performance Computing
5个月前
已完结
Stress in Single-and Multiribbon Complementary FETs (CFETs): Evolution in Process Flow and Impact on Drive Current
5个月前
已完结
Dehydration-Induced Redistribution of Amphiphilic Molecules between Cytoplasm and Lipids Is Associated with Desiccation Tolerance in Seeds
5个月前
已关闭
29.2 A $\boldsymbol{0.021}\boldsymbol{\mu}\mathbf{m^{2}}$ High-Density SRAM in Intel-18A-RibbonFET Technology with PowerVia-Backside Power Delivery
5个月前
已完结
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