Lv4
610 积分 2025-05-04 加入
Integration of 0.75 V VDD Oxide-Semiconductor 1T1C Memory with Advanced Logic for an Ultra-Low-Power Low-Latency Cache Solution
2个月前
已完结
High-Density Wafer Level Connectivity Using Frontside Hybrid Bonding at 250nm Pitch and Backside Through-Dielectric Vias at 120nm Pitch After Extreme Wafer Thinning
2个月前
已完结
The Incredible Shrinking Transistor - Shattering Perceived Barriers and Forging Ahead
2个月前
已完结
Intel 18A Platform Technology Featuring RibbonFET (GAA) and PowerVia for Advanced High-Performance Computing
2个月前
已完结
Stress in Single-and Multiribbon Complementary FETs (CFETs): Evolution in Process Flow and Impact on Drive Current
2个月前
已完结
Dehydration-Induced Redistribution of Amphiphilic Molecules between Cytoplasm and Lipids Is Associated with Desiccation Tolerance in Seeds
2个月前
已关闭
29.2 A $\boldsymbol{0.021}\boldsymbol{\mu}\mathbf{m^{2}}$ High-Density SRAM in Intel-18A-RibbonFET Technology with PowerVia-Backside Power Delivery
2个月前
已完结
Demonstration of a Stacked CMOS Inverter at 60nm Gate Pitch with Power Via and Direct Backside Device Contacts
3个月前
已完结
Two nanometre CMOS technology
3个月前
已完结
Silicon RibbonFET CMOS at 6nm Gate Length
3个月前
已完结
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