Lv4
790 积分 2021-08-24 加入
Thin Die Flip Chip Process Enablement for Stacked IC Memory Packages
4个月前
已完结
The FOStrip® Technique - A Low-Cost Solution for the Strip Level Fan-Out on Substrate Package
4个月前
已关闭
Flip Chip Typical Failure Case Analysis Research
5个月前
已完结
Enhanced size effects on shear performance and fracture behavior of BGA structure micro-scale Cu/Sn–3.0Ag–0.5Cu/Cu joints at low temperatures
5个月前
已完结
Study of microstructure, growth orientations and shear performance of Cu/Sn-3.0Ag-0.5Cu/Cu solder joints by using thermal gradient bonding
5个月前
已完结
Microstructures, mechanical properties and reliability induced from size effect in Sn-based solder joints: Review
5个月前
已完结
Bump scaling and shear test requirements
5个月前
已完结
Size effects on IMC growth of Cu/Ni/Sn-3.5Ag microbump joints during isothermal aging and prediction of shear strength using ANN
5个月前
已完结
Substrate Design Optimization of Fine Pitch FCCSP for Molded Underfill Void Free Evaluation
9个月前
已完结
BLR Drop Test Study for FCCSP Package with OSP/Cu Solder Pad finish
9个月前
已完结
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