Lv4
780 积分 2021-08-24 加入
Fine Pitch High Density CoWoS-R Package with 1.4/1.4um RDL Lines and 3um via CD
2个月前
已完结
CoWoS Architecture Evolution for Next Generation HPC on 2.5D System in Package
2个月前
已完结
Thin Die Flip Chip Process Enablement for Stacked IC Memory Packages
9个月前
已完结
The FOStrip® Technique - A Low-Cost Solution for the Strip Level Fan-Out on Substrate Package
10个月前
已关闭
Flip Chip Typical Failure Case Analysis Research
10个月前
已完结
Enhanced size effects on shear performance and fracture behavior of BGA structure micro-scale Cu/Sn–3.0Ag–0.5Cu/Cu joints at low temperatures
10个月前
已完结
Study of microstructure, growth orientations and shear performance of Cu/Sn-3.0Ag-0.5Cu/Cu solder joints by using thermal gradient bonding
10个月前
已完结
Microstructures, mechanical properties and reliability induced from size effect in Sn-based solder joints: Review
10个月前
已完结
Bump scaling and shear test requirements
10个月前
已完结
Size effects on IMC growth of Cu/Ni/Sn-3.5Ag microbump joints during isothermal aging and prediction of shear strength using ANN
10个月前
已完结
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