Lv1
60 积分 2022-11-16 加入
Overview of atomic layer etching in the semiconductor industry
1小时前
已完结
Reliability investigation of 0.07-μm InGaAs-InAlAs-InP HEMT MMICs with pseudomorphic In0.75Ga0.25As channel
2个月前
已完结
Co-doped Ru liners for highly reliable Cu interconnects with selective Co cap
2个月前
已完结
Progress in the development and understanding of advanced low k and ultralow k dielectrics for very large-scale integrated interconnects—State of the art
2个月前
已完结
Recent Advances in Barrier Layer of Cu Interconnects
2个月前
已完结
Robust Co alloy design for Co interconnects using a self-forming barrier layer
2个月前
已完结
Self-Heating in iN8–iN2 CMOS Logic Cells: Thermal Impact of Architecture (FinFET, Nanosheet, Forksheet and CFET) and Scaling Boosters
2个月前
已完结
Backside Power Delivery: Game Changer and Key Enabler of Advanced Logic Scaling and New STCO Opportunities
2个月前
已完结
The future transistors
2个月前
已完结
Addressing interconnect challenges for enhanced computing performance
2个月前
已完结
皖公网安备34019202002308
