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80 积分 2022-11-16 加入
Low Resistivity Titanium Nitride Thin Film Fabricated by Atomic Layer Deposition on Silicon
6天前
已完结
Overview of atomic layer etching in the semiconductor industry
2个月前
已完结
Reliability investigation of 0.07-μm InGaAs-InAlAs-InP HEMT MMICs with pseudomorphic In0.75Ga0.25As channel
4个月前
已完结
Co-doped Ru liners for highly reliable Cu interconnects with selective Co cap
4个月前
已完结
Progress in the development and understanding of advanced low k and ultralow k dielectrics for very large-scale integrated interconnects—State of the art
4个月前
已完结
Recent Advances in Barrier Layer of Cu Interconnects
4个月前
已完结
Robust Co alloy design for Co interconnects using a self-forming barrier layer
4个月前
已完结
Self-Heating in iN8–iN2 CMOS Logic Cells: Thermal Impact of Architecture (FinFET, Nanosheet, Forksheet and CFET) and Scaling Boosters
4个月前
已完结
Backside Power Delivery: Game Changer and Key Enabler of Advanced Logic Scaling and New STCO Opportunities
4个月前
已完结
The future transistors
4个月前
已完结
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