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40 积分 2026-06-23 加入
Characterization and Modeling of Atomic Layer Deposited High-Density Trench Capacitors in Silicon
3个月前
已完结
Deep silicon etching technology and applications: a review
3个月前
已完结
Modeling, Fabrication, and Characterization of 3-D Capacitor Embedded in Through-Silicon Via
3个月前
已完结
Structural Integrity of 3-D Metal–Insulator–Metal Capacitor Embedded in Fully Filled Cu Through-Silicon via
3个月前
已完结
A 3D heterogeneous integration method using LTCC wafer for RF applications
3个月前
已完结
Ultrahigh Capacitance Density for Multiple ALD-Grown MIM Capacitor Stacks in 3-D Silicon
3个月前
已完结
High capacitance density MIS capacitor using Si nanowires by MACE and ALD alumina dielectric
3个月前
已完结
ALD Options for Si-integrated Ultrahigh-density Decoupling Capacitors in Pore and Trench Designs
3个月前
已完结
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