Lv5
1090 积分 2023-12-14 加入
Simulation and testing of a newly designed half bridge module with silicon carbide MOSFET
1天前
已完结
Simulation and testing of a newly designed half bridge module with silicon carbide MOSFET
1天前
已关闭
Electro-thermal crosstalk revealed by Raman thermography in multi-fin β-Ga2O3 FinFETs
21天前
已完结
Interfacial thermal transport investigation of β-Ga2O3/4H-SiC power devices via active-learning-driven neuroevolution potential
22天前
已完结
4.1/3.5 kV breakdown voltage in depletion/enhancement-mode MOCVD-grown Ga 2 O 3 MOSFETs on sapphire substrates
24天前
已完结
Enabling record-high heat flux in wide-bandgap electronics via in-chip microfluidic cooling on diamond substrates
24天前
已完结
Thermal interface material of carbon fiber enhanced micro-nano Cu sintering for power module thermal management
24天前
已完结
Thermal conductivity of bulk and thin film [beta]-Ga2O3 measured by the 3[omega] technique
26天前
已完结
Near-junction microfluidic cooling for GaN HEMT with capped diamond heat spreader
27天前
已完结
Near-junction microfluidic cooling for GaN HEMT with capped diamond heat spreader
1个月前
已完结
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