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1730 积分 2023-12-14 加入
High Performance 3-D Stacked Packaging of SiC Power Module Enabled by Direct Plated Copper Ceramic Interposer
18天前
已完结
Parasitic Inductance Modeling and Reduction for Wire-Bonded Half-Bridge SiC Multichip Power Modules
18天前
已完结
A DBC-stacked H-bridge SiC power module with optimized electro-thermal performance
19天前
已完结
Development of high-thermal conductive Ag@diamond composite sintering paste and its application in power modules
22天前
已完结
Interfacial thermal transport investigation of β-Ga2O3/4H-SiC power devices via active-learning-driven neuroevolution potential
22天前
已完结
Achieving superior heat dissipation in β-Ga2O3 MOSFETs via diamond spreading layer and substrate-embedded silicon microchannels
22天前
已完结
From Growth to Performance: Emerging Frontiers in Diamond Materials for High‐Performance Devices
1个月前
已完结
Advanced thermal management technologies for high-power electronic devices: A review of passive, active, and hybrid cooling strategies, materials innovations, and AI-driven design for data-center, EV, and aerospace electronics
1个月前
已完结
Electrical Tree Failure at DBC Substrate-Silicone Gel Interface in High-Voltage Power Module Under Positive Square Wave Voltage
1个月前
已完结
Dielectric Properties Characterization and Evaluation of Commercial Silicone Gels for High-Voltage High-Power Power Electronics Module Packaging
1个月前
已完结
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