Lv1
8 积分 2023-03-17 加入
Energy-efficient thermal management of integrated chips based on the phase change-copper foam composite liquid cooling module
1个月前
已完结
Interfacial Engineering Enables Flexible Composite Film Achieving Ultrahigh Thermal Conductivity and Wave Transparency
1个月前
已完结
Highly through-plane thermally conductive graphene materials via multi-flow casting
1个月前
已完结
Asymmetric thermal transport in a trilayer van der Waals heterostructure
1个月前
已完结
Thermo-mechanical reliability enhancement in 3D packaging through TTSV layout optimization and characteristic dimension-based thermal management
1个月前
已完结
Ultralow and tunable thermal conductivity of parylene C for thermal insulation in advanced packaging
1个月前
已完结
Machine learning design of electronic packaging materials: A phonon spectrum continuity matching framework for high thermal conductivity
1个月前
已完结
Experimental investigation on thermal-hydraulic performance of a gravity-driven two-phase loop for high-heat-flux chip cooling
1个月前
已完结
Ultrareliable, flexible, low-cost, and highly thermally conductive silicone rubber for interfacial thermal management in extreme environments
1个月前
已完结
Effect of interlayer material and thickness on interfacial thermal transport on GaN/diamond heterostructures
1个月前
已完结
皖公网安备34019202002308
