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10 积分 2023-03-17 加入
Strength and electrical conductivity synergy in graphene/copper composites with oriented multicore architecture
19小时前
待确认
Achieving ultrahigh strength and high electrical conductivity in Cu composite reinforced with intragranular sub-10 nm W particles
4天前
已完结
Ultrahigh Thermal Conductivity in a 12‐nm Polymer Crystal Limited by Boundary Scattering and Surface Amorphization
7天前
已完结
Dual‐Field Synergistic Orientation of Carbon Fibers for High‐Efficiency Thermal Management
10天前
已完结
Advanced Packaging – A must for the Next-Gen AI and HPC Hardware and not Only!
13天前
已完结
Liquid-Cooled Heat Dissipation Technology for Co-Packaged Optics over 12.8 Tbps
13天前
已完结
Breaking Thermal Bottleneck in 3D HBM-on-GPU Integration via System-Technology Co-Optimization
14天前
已完结
Integrated Microfluidic Cooling of Heterogeneous HBM–GPU Package With Die Height Difference
14天前
已完结
Development of AlN Fillers for Composite Resins with High Thermal Conductivity and Low Bond-Line Thickness
18天前
已完结
3D IC Thermal Management with BEOL Wafer-Scale Sputtered Vertical h-BN
18天前
已完结
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