| 标题 |
Thermo-mechanical reliability enhancement in 3D packaging through TTSV layout optimization and characteristic dimension-based thermal management |
| 网址 | |
| DOI | |
| 其它 |
期刊:Thermal science and engineering progress 作者:Wenchao Tian; Shaoli Huang; C.‐M. Hu; Shuaiqi Zhang; Xiafei Han; et al 出版日期:2025-07-22 |
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(2025-6-4)