| 标题 |
Investigation on curing characterization of epoxy molding compounds with different latent catalysts by thermal, electrical and mechanical analysis |
| 网址 | |
| DOI | |
| 其它 |
期刊:Thermochimica Acta 作者:Da Eun Lee; Han-Jung Cho; Byung-Seon Kong; Hyung Ouk Choi 出版日期:2019-02-20 |
| 求助人 | |
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(2025-6-4)