| 标题 |
Experimental and simulation study on hygroscopic hydrogel-based thermal management of electronic device |
| 网址 | |
| DOI | |
| 其它 |
期刊:Chemical Engineering Journal 作者:Wansheng Li; Yu Feng; Taisen Yan; Yongqiang Zhang; Xingguo Wei; et al 出版日期:2024 |
| 求助人 | |
| 下载 |
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(2025-6-4)