| 标题 |
Electromigration comparison of selective CVD cobalt capping with PVD Ta(N) and CVD cobalt liners on 22nm-groundrule dual-damascene Cu interconnects |
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| 其它 |
期刊:2013 IEEE International Reliability Physics Symposium (IRPS) 作者:A. H. Simon; T. Bolom; C. Niu; F. H. Baumann; C. Hu; et al 出版日期:2013-06-26 |
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(2025-6-4)