| 标题 |
Thermo-Mechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis |
| 网址 | |
| DOI |
10.1115/ipack2019-6416
doi
|
| 其它 |
期刊:ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems 作者:Dustin Pense; Hayden Carlton; David Huitink 出版日期:2019-10-07 |
| 求助人 | |
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(2025-6-4)