| 标题 |
Surface Topography Control for Polymer/Cu Hybrid Bonding |
| 网址 | |
| DOI | |
| 其它 |
期刊:2024 International Conference on Electronics Packaging (ICEP) 作者:Yuzo Nakamura; Yusuke Kondo; Kenta Hayama; Fabiana Lie Tanaka; Fumihiro Inoue 出版日期:2024-05-29 |
| 求助人 | |
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(2025-6-4)