| 标题 |
Search for copper diffusion at hybrid bonding interface through chemical and electrical characterizations |
| 网址 | |
| DOI | |
| 其它 |
期刊:Microelectronics Reliability 作者:Joris Jourdon; Sandrine Lhostis; Stéphane Moreau; Patrick Lamontagne; Hélène Frémont 出版日期:2021-11-01 |
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(2025-6-4)