| 标题 |
A 25Gb/s integrated MZM modulator and high bandwidth electrical driver with a packaged chipset in an optical module for high speed optical interconnects |
| 网址 | |
| DOI |
10.1109/ICEPT67137.2025.11157465
doi
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| 其它 |
期刊:2025 26th International Conference on Electronic Packaging Technology (ICEPT) 作者:Yu Ban; Hanzi Sun; Yonghe Zhuang; Xiaoyan Hu; Zhiqiang Wang 出版日期:2025 |
| 求助人 | |
| 下载 |
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(2025-6-4)