| 标题 |
Recent progress in thermal management materials for electronic devices: interfacial thermal resistance regulation, thermal network construction, and device reliability boundaries |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of Materials Science: Materials in Electronics 作者:Liuyang Wang; Xinyu Lu; Libin Bai 出版日期:2026-07-17 |
| 求助人 | |
| 下载 | 求助已完成,仅限求助人下载。 |
PDF的下载单位、IP信息已删除
(2025-6-4)