| 标题 |
Mechanistic investigation into synergistic effects of Sb and Bi on enhancing properties and solder joint reliability of Sn-3.0Ag-0.5Cu: Experiments and first-principles calculations |
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| DOI | |
| 其它 |
期刊:Materials Characterization 作者:Jian Zhao; Senlin Yi; Jiangshan Liu; Yipeng Xiang; Jianhua Zhao; et al 出版日期:2026-07-01 |
| 求助人 | |
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(2025-6-4)