| 标题 |
[高分] J.Lead Ceramic Packages for High Performance MEMS Accelerometers: Simulation and Experimental Results
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| DOI |
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| 其它 | F.-X. Boillot et al., "J.Lead Ceramic Packages for High Performance MEMS Accelerometers: Simulation and Experimental Results" presented at 6th MIcroNAno-electronics Packaging and Assembly, Design and Manufacturing Forum, Grenoble 2018. |
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(2025-6-4)