| 标题 |
Preparation of core-shell structured SiO2@Ag spheres and their role in improving micro-sized Ag flake filled electrically conductive adhesive for LED packaging |
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| DOI | |
| 其它 |
期刊:2017 18th International Conference on Electronic Packaging Technology (ICEPT) 作者:Han Jiang; Min-Bo Zhou; Jie-Fei Zhu; Xin-Ping Zhang 出版日期:2017-08-01 |
| 求助人 | |
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(2025-6-4)