| 标题 |
Adhesion characteristics of Cu/Ni–Cr/polyimide flexible copper clad laminates according to Ni:Cr ratio and Cu electroplating layer thickness |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of Materials Science: Materials in Electronics 作者:Bo‐In Noh; Jeong‐Won Yoon; Boyoung Lee; Seung‐Boo Jung 出版日期:2008-10-27 |
| 求助人 | |
| 下载 |
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(2025-6-4)