| 标题 |
专利、报告等 Determination of Copper/EMC Interface Fracture Toughness during Manufacturing, Moisture Preconditioning and Solder Reflow Process of Semiconductor Packages |
| 网址 | |
| DOI |
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| 其它 | 作者:M. H. Shirangi; W. H. Müller; B. Michel |
| 求助人 | |
| 下载 | 暂无链接,等待应助者上传 |
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(2025-6-4)