| 标题 |
Suppression of Ag dewetting in submicron Cu@Ag particles in paste for improving sinter bondability through surface modification |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of materials research and technology 作者:Yeongjung Kim; Jong‐Hyun Lee 出版日期:2024-04-15 |
| 求助人 | |
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(2025-6-4)