| 标题 |
Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly |
| 网址 | |
| DOI | |
| 其它 |
期刊:Microelectronics Reliability 作者:Nele Van Steenberge; Paresh Limaye; Geert Willems; Bart Vandevelde; Inge Schildermans 出版日期:2007-02-01 |
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(2025-6-4)