| 标题 |
Novel Porous Gold Microspheres Anisotropic Conductive Film (PGMS‐ACF) with High Compression Ratio for Flip Chip Packaging |
| 网址 | |
| DOI | |
| 其它 |
期刊:Advanced Electronic Materials 作者:Li Zhang; Zhaomeng Wang; Geng Wei; Puyue Xia; Sining Fan; et al 出版日期:2025-05-27 |
| 求助人 | |
| 下载 |
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(2025-6-4)