| 标题 |
3D Modeling of Electromigration Combined with Thermal-Mechanical Effect for IC Device and Package |
| 网址 | |
| DOI | |
| 其它 |
期刊:2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 作者:Yong Liu; L. Liang; S. Irving; T. Luk 出版日期:2007-04-16 |
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(2025-6-4)